A production ready micro SoM based on Snapdragon™ 845 SoC architected for Artificial Intelligence and Immersion

The compact sized Inforce 67X1 SOM’s multiple MIPI-CSI interfaces and on-device artificial intelligence (AI) allows users to capture cinema-grade videos and blur the lines between physical and virtual worlds. The product’s enhanced hardware and software capabilities bring high-performance, true-to-life cinematic video capture, with 64x more high-dynamic range color information for video capture and playback on Ultra HD Premium displays, compared to the previous generation. This massive boost in color information includes 10-bit color depth for over one billion shades of colors that can be displayed to the wide Rec. 2020 gamut for brilliant 4K/Ultra HD @60 fps videos. The Adreno GPU enables room-scale 6 degrees of freedom (6DoF) with simultaneous localization and mapping (SLAM)—for features such as wall-collision detection. Snapdragon 845 (SDA845) also introduces “Adreno foveation,” which substantially reduces power consumption, improves visual quality and boosts XR application performance, as compared to the previous generation. All these features make it ideal for manufacturers to develop SWaP constrained devices in the immersive multimedia space, wearables, portable healthcare and connected cameras’ domain.

The Snapdragon 845 platform has processor advancements that offer an improved user experience

Qualcomm Kryo 385 CPU: Manufactured in 2nd gen 10nm LPP, optimized across 4 performance and 4 efficiency cores for higher performance.
Hexagon™ 685 DSP: Designed to support supports sophisticated, on-device AI processing, delivering richer camera, voice, XR and gaming experiences.
Adreno™ 630 VPS: Featuring room-scale 6DoF with SLAM, Adreno Foveation, and significantly improved graphics rendering and video processing, the Visual Processing Subsystem(VPS) comprising the GPU, VPU and DPU provides a larger-than-life immersive experience. It includes support for Vulkan 2/OpenGL ES 3.2/OpenCL.
Dual 14-bit Spectra™ 280 ISPs support up to 16MP each for simultaneous concurrent cameras
Qualcomm® AI Engine: The 3rd generation AI Platform enables on-device intelligence and simplifies how you take pictures and videos. It also enables enhanced features like camera bokeh, more true to life XR, gaming, and long lasting battery life. The Snapdragon core hardware architectures are engineered to run AI applications quickly and efficiently.

Block Diagram

6701 micro som block diagram

Specifications

Based on the Snapdragon™ 845 processor (SDA845) manufactured in 10nm FinFET process technology

Customized Kryo™ ARMv8 compliant 64-bit Octa-core CPUs arranged in two dual-clusters, running at 2.8GHz (Gold) and 1.8GHz (Silver) each
Adreno™ 630 VPS with 64 bit addressing and designed for significantly improved graphics and efficient rendering as compared to the previous generation
Hexagon™ 685 DSP with dual-Hexagon vector processor designed for on-device AI processing, low-power audio, XR/gaming and computer vision processing
Spectra™ 280 camera (dual) Image Signal Processors (ISPs) to support up to 24MP single or 16MP@60 fps dual cameras

PROCESSING POWER, MEMORY, AND STORAGE

Qualcomm® Snapdragon™ 845 (SDA845 SoC) processor
4GB on-board LPDDR4X RAM
64GB UFS ROM
1x µSD card v3.0 interface
USB-C on USB 3.1/gen1 + USB-SS
Intelligent scalable power management for superior energy efficiencies through PMIC

AUDIO, VIDEO, INTERFACE, AND CONNECTIVITY

Audio Lineout; Mic-In
UltraHD (4K) display on USB-C
H.265 (HEVC)/H.264 (AVC)/VP9 playback & capture @4K60 fps
Concurrent 4K60 10b encode + 4K60 10b decode
Dual MIPI-CSI cameras up to 16MP@60fps
4-lane MIPI-DSI capability
Multiple BLSPs for UART/I2C/SPI/GPIOs
802.11n/ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT/LE 5.x via WCN3990
GPS/GLONASS via SDR660G
1x 1-lane PCIe Gen 2 and 1x 1-lane PCIe Gen 3
Audio Lineouts, HPH and Mic-In from integrated PMIC codec

POWER, MECHANICAL, AND ENVIRONMENTAL

Power: +3.8V/6A Input
Dimensions: 50mm x 28mm
Operating Temp: Commercial Temperature
Storage Temp: -20 to 85 C
Relative Humidity: 5 to 95% non-condensing
RoHS and WEEE compliant

Snapdragon™ 845 SoC – A superior platform for Artificial Intelligence and Immersion

Thoughtfully designed with tech savvy consumers in mind, the Snapdragon 845 utilizes heterogenous compute capabilities to enable immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI) and lightning-fast connectivity. The Snapdragon 845 (SDA845) also introduces a hardware isolated subsystem called the secure processing unit (SPU), which is designed to add vault-like characteristics to existing layers of Qualcomm Technologies’ security features.

Here are a few features of the Snapdragon 845 SoC

Kryo CPU - The custom built 64-bit ARM v8-compliant Kryo 385 CPU has independent efficiency and power clusters, each designed to optimize for a unique user experience.
- Four performance cores up to 2.8GHz (25 percent performance uplift compared to previous generation)
- Four efficiency cores up to 1.8GHz
- 2MB shared L3 cache
- 3MB system cache
Hexagon DSP - The Hexagon 685 DSP is designed for advanced imaging and computer vision tasks and to significantly improve performance and battery life. It includes the Qualcomm All-Ways Aware™ sensor hub and HVX for optimal efficiency.
- 3rd Generation Hexagon Vector DSP (HVX) for AI and imaging
- 3rd Generation Qualcomm All-Ways AwareTM Sensor Hub
- Hexagon scalar DSP for audio
Adreno VPS – The Adreno Video Processing system comes with up to 30% faster graphics rendering and 30% more power efficient for all visual processing. Developers gain access to the latest graphics APIs like OpenGL 3.0/3.2, Vulkan 2, DX12 FL 12 and OpenCL 2.0 full profile.
- 2.5X higher display throughput
- 2400x2400 @ 120 FPS per eye
- Room-Scale 6DoF with simultaneous localization and mapping (SLAM)
- Adreno Foveation: multiple technology advancements for multi-view, tile-based foveation with eye-tracking and fine grain preemption
Spectra ISP - The 14-bit Qualcomm Spectra 280 architecture offers active depth sensing, capable of capturing changes in depth as small as 0.1mm. This will enable users to detect walls and other surrounding objects while using XR. Active depth sensing also improves image quality for bokeh effect, portrait, refocusing and other high-resolution photography features.
- Ultra HD premium capture
- Qualcomm Spectra Module Program, featuring Active Depth Sensing
- Motion Compensated Temporal Filtering video capture
- Multi-frame noise reduction
- High performance capture up to 16MP @60FPS
- Slow motion video capture (720p @480 fps)
- ImMotion computational photography
Qualcomm AI Engine - Qualcomm AI Engine hardware includes the Hexagon Vector Processor, Adreno VPS, and Kryo CPU, plus software features that all contribute to make on-device AI experiences possible in camera, audio, security and more. The key benefits of on-device AI include real-time responsiveness, improved privacy, and enhanced reliability.
Qualcomm Security Foundation - Robust security to address ever-increasing threats to device security and privacy are an absolute necessity and the Security suite is designed to provide exactly that.

android

Android 9 (Pie) BSP release

Periodic Android based BSP releases include in-depth documentation along with a host of royalty-free multimedia codecs
Contact Sales team at sales@inforcecomputing.com for software solutions and customizations

The full-featured releases have support for the following peripheral devices and I/Os:

Snapdragon™ 845 (SDA845) processor Octa-core Kryo™ CPUs running at 2.8GHz (Gold Cluster) and 1.8GHz (Silver Cluster)
USB-C (USB 3.1/gen 1) with UltraHD display support; Input, OTG, MTP and mass storage devices
USB-SS based input, MTP, camera and mass storage devices
WiFi 802.11n/ac dual band (2.4 GHz and 5 GHz client functionality) and DBS
BLE 5.x
SD card access and UFS memory, USB, I2S and low speed peripherals(I2C/UART/SPI) through BLSP programming
Persistent MAC address programming for WiFi/BT
MIPI-DSI based displays with touch screen support
Qualcomm SDKs’ support
MIPI-CSI camera sensor on either CSI interface (may require image quality tuning based on sensor choice)
Analog and Digital audio
Miracast
Control of user provisioned LEDs
Android OTA update Procedure
Android Verified Boot(dm-verity)
Android Recovery

Specialized solutions through SDKs from Qualcomm that are enabled from the Android BSP on Inforce 6701 SOM:

Snapdragon Neural Processing Engine SDK, for artificial intelligence (AI) is designed to run one or more neural network models trained in Caffe/Caffe2, ONNX, or TensorFlow on Snapdragon platforms, whether that is the CPU, GPU or DSP and provides customers a powerful, energy efficient platform for delivering intuitive and engaging deep learning-driven experiences on their product.
FastCV SDK for Android that is designed to make it easy to integrate facial processing and facial recognition features into your application. Inforce also enables the OpenCV APIs to provide even more extensive capabilities in the Computer Vision domain.
The Hexagon™ SDK that is designed to enable device manufacturers and independent software providers to optimize the features and performance of multimedia software. These optimizations help allow audio, imaging, embedded vision, and heterogeneous computing acceleration on the Hexagon DSP embedded in Snapdragon processors.
The Adreno™ SDK, with which you can take full advantage of the graphics and computation power provided by the Adreno GPU and optimize applications for faster frame rates, smoother rendering, and longer battery life.
Symphony SDK that provides APIs to put tighter control on how you want to utilize the various compute units within Qualcomm® Snapdragon™ processors like multicore CPUs, GPU and DSPs for task scheduling, heterogeneous offload, and power and thermal management.

Early access to leading edge APIs and next generation features.
Long-term commitment of supply assurance from product introduction
A product roadmap that keeps developers on the latest technology curve from Qualcomm

Documentation

Documents
Inforce 6701 Datasheet	Download
Inforce 6701 Android Release	Download

Introduction

1. What is Inforce 67X1™ Micro SOM?

The Inforce 67X1 Micro SOM is a high performance tiny System on Module (SoM) solution for embedded systems designers. It is based on Qualcomm’s custom Octa-core 64-bit Kryo(385) CPU (Snapdragon 845) processor for embedded applications. The plug-and-play Inforce 67X1 Micro SOM comes in an ultra-small form factor of 28mm x 50mm and provides pin, electrical, and form-factor compatibility across a wide product line of Snapdragon processor-based SOMs from Inforce for easy migration.

2. Does the Micro SoM have variants based on different configurations?

Yes. Inforce offers different SKUs of the Micro SoM. The available variants are described under the ‘PRICING’ tab at location https://www.inforcecomputing.com/products/single-board-computers-sbc/qualcomm-snapdragon-845-inforce-67X1-micro-som

3. Does Inforce offer a reference carrier board for its SoMs or other form factors based on the Qualcomm Snapdragon 845 processor?

Yes. Inforce offers a reference carrier board for this SoM. All native interfaces of the Snapdragon 845 processor are brought out on this carrier. Please stay tuned to our website for more details and availability on the development kit which shall comprise of the Inforce 67X1 SoM and the reference carrier.

4. Does Inforce provide any custom design solutions since some designs wouldn’t be able to use the standard SoM’s form factor and or features?

Yes, while we offer standard products off-the-shelf (OTS) on our website and through our multiple distributors, we also have a strong background in customized hardware and software solutions. We offer pre-validated build-to-order (BTO) configurations, as well as configure-to-order (CTO) options for existing products. For customers wanting to design their own unique form-factor carrier board to interface with the OTS Inforce 67X1 Micro SOM, we offer design assistance support packages that include dedicated engineer, reference schematics and design reviews—contact Inforce sales for more details. In addition, Inforce also offers full custom hardware design and associated software/device driver development, for those projects where a unique hardware design is required to meet sophisticated technical challenges.

5. Where can I find more information about the Inforce 67X1 Micro SOM? What do I get when I buy an Inforce 67X1 Micro SOM? Is the device available internationally?

Inforce’s website has a lot of useful information about our SOMs at http://www.inforcecomputing.com/products/system-on-modules. Please check on the exact product SKU for the pre-loaded software, available memory and supported temperature ranges. The Inforce 67X1 Micro SOM requires a carrier board (like all SOMs do) to power up and connect to peripheral devices and gain access to the extensive set of I/Os that are available on the Micro SOM. If you are considering the Inforce 67X1 Micro SOM for the first time, please purchase the comprehensive Inforce 67X1 Development Kit, which includes the Micro SOM, the reference carrier board, and a starter kit. Inforce’s Snapdragon processor-based Micro SOMs are all cross-compatible (pin, connector, and form factor) with Inforce’s reference carrier board designs, ensuring a smooth path to migrate/upgrade to new Snapdragon processor-based Micro SOMs in the future. Once you register the product with Inforcecomputing.com, you would get dedicated support from Inforce. The board ships to most places worldwide and relevant shipping and local tax/customs duty charges may apply. Please contact sales@inforcecomputing.com for pricing details or any additional questions that you may have before buying an Inforce 67X1.

6. Does Inforce have a blog?

Yes! You can find our periodic blogs at http://inforcecomputing.com/blog/category/articles. Here you can keep up with all of the latest information about Inforce products, conference/trade show appearances, and innovative customer case-studies and applications.

General

7. What are the accessories available?

Our website http://www.inforcecomputing.com/products/accessories lists all the available accessories. Please note that User guides and product datasheets are available for all accessories.

8. Does the board support a cellular or GSM connection?

The Inforce 67X1 does not include support for a wireless modem. Third party cellular modem dongles can be connected to the Inforce 67X1 based development kit via USB ports and may require special drivers from the respective manufacturers. We can also help you design in a 3rd party cellular modem module in your custom carrier board that is mated with an Inforce Micro SOM.

9. What is the storage capacity of the Inforce 67X1 Micro SOM? Is it expandable?

The on board storage (UFS) capacity is 64GB. Storage can be expanded by connecting a Micro-SD card or USB storage on the Inforce 67X1 development kit.

10. What are the performance details of the Inforce 67X1? What is the speed of the RAM?

The Inforce 67X1 Micro SOM is based on the Snapdragon 845 (SDA845) processor, which includes custom Qualcomm® Kryo™ Quad-core 64-bit ARM V-8 compliant CPUs organized as two clusters viz., Performance@2.8GHz each and Efficiency@1.8GHz each with 2MB shared L3 cache and 3MB system cache.

The onboard 4GB LPDDR4X RAM operates at 1866 MHz

All our Android releases are benchmarked with Antutu and validated with the Qualcomm Trepn™ Profiler to ensure that all cores are capable of operating at their maximum frequency.

11. What is the stacked height of the SOM mounted on the carrier board?

The height of the Inforce 6701 Micro SOM is between 5.9mm to 6.6mm depending on the presence of the EMI shield. The full height when mounted on mating connectors on the carrier board is between 6.8mm and 7.5mm. Please check on product SKU details for the presence of the EMI shield.

12. What types of displays are supported and at what resolutions?

The Snapdragon 845 (SDA845) natively supports dual-link MIPI-DSI and USB-C with DP Alternate Mode.

The Inforce 67X1 Development Kit has a 51-pin FI-R DSI connector with support for dual MIPI-DSI ports. Note that the displays are not provided as peripherals with the Inforce 67X1 development kit. They can be purchased fromhttp://inforcecomputing.com/product/accessories.html.

13. What are the capabilities of the video Decoder/Encoder on the Inforce 67X1 Micro SOM?

Please refer to http://developer.android.com/guide/appendix/media-formats.html for supported codecs from Android. Hardware accelerated capabilities of the SDA845 SoC :

	Supported Codec	Profile(s)	Resolution/Bitrate/Framereate
Video Decode	H.265 (HEVC)	Main profile(8-bit/10-bit) up to level 6	720p/120Mbps/480fps 1080P/120Mbps/240fps 3840x2160/120Mbps/60fps 4096x2160/120Mbps/60fps 4096x2304/120Mbps/30fps
	H.264 (AVC)	(Constrained) Baseline, main, (Constrained) high profiles; up to level 5.2	720p/120Mbps/480fps 1080P/120Mbps/240fps 3840x2160/120Mbps/60fps 4096x2160/120Mbps/60fps 4096x2304/120Mbps/30fps
	H.263	Profile 0; up to Level 70	720x576/16mbps/30fps 864x480/16mbps/30fps
	MPEG-4	Simple, Advanced simple profiles; up to levels 6 and 5, respectively	1080P/40Mbps/30fps
	MPEG-2	Main profile	1080P/40mbps/30fps
	VC-1	Adv Main, Simple and High profile	1080P/20mbps/30fps
	DivX	DivX 4/5/6	1080P/10mbps/30fps
	VP8	Profile 0, Version 0/1/2/3	720p/100Mbps/240fps 1080P/100Mbps/240fps 3840x2160/100Mbps/30fps 4096x2160/100Mbps/30fps 4096x2304/100Mbps/24fps
	VP9	Profile 0; 8-bit; Level 5.1 Profile 2; 10-bit; Level 5.1	720p/120Mbps/480fps 1080P/120Mbps/240fps 3840x2160/120Mbps/60fps 4096x2160/120Mbps/60fps 4096x2304/120Mbps/30fps
Video Encode	H.265 (HEVC)	Main profile 8-bit,up to level 6; Main profile 10-bit,up to level 6 (10-bit HDR encoding with HLG standard only)	720p/120Mbps/480fps 1080P/120Mbps/240fps 3840x2160/120Mbps/60fps 4096x2160/120Mbps/60fps 4096x2304/120Mbps/30fps
	H.264 (AVC)	Baseline, main, high profiles; up to level 5.1	720p/120Mbps/480fps 1080P/120Mbps/240fps 3840x2160/120Mbps/60fps 4096x2160/120Mbps/60fps 4096x2304/120Mbps/30fps
	H.263	Profile 0; up to Level 70	352×288/2Mbps/30fps 864x480/2Mbps/30fps
	MPEG-4	Simple profile; till level 6	720P/4Mbps/30fps
	VP8	Profile 0, Version 0/1/2/3	720p/100Mbps/240fps 1080P/100Mbps/120fps 3840x2160/100Mbps/30fps 4096x2160/100Mbps/30fps 4096x2304/100Mbps/24fps

14. What are the camera capabilities of the Inforce 67X1 Micro SOM?

The Inforce 67X1 Micro SOM has up to three MIPI-CSI camera interfaces that support 4 lanes from CSI0, CSI1 and CSI2 each. Please check on the exact product SKU for the number of camera interfaces supported. 2x14-bit ISP that are 16MP+16MP@60fps capable Dual simultaneous camera capability is possible on a system built on this SoM.

Inforce platforms are typically validated with a Sony IMX230 sensor (21MP) based camera module for 4K@30fps capture and record. Note that the camera is not provided as part of the Inforce 67X1 development kit. It can be purchased as an accessory from http://www.inforcecomputing.com/products/accessories.

15. How much power does the SoM draw? Is it possible to measure the power?

The Inforce 67X1 SoM takes 3.8V Power Input. The Development Kit is powered by a 12V/3A wall adaptor. Our products typically offer support for 7V-16V power input range. The total power consumed by the Inforce 67X1 Development Kit ranges between 6W to 17W when different use cases are executed. There are a few test points made available to measure run-time power on the board. The input current through the DC jack can be measured during different use-cases. Please note that we run the Qualcomm Trepn™ profiler as part of our validation process on all of our stock Android releases.

16. What are the audio capabilities?

Audio is brought out as line-outs, HPH and mic-in from the integrated PMIC audio codec on the SoM. Audio is also available from the USB lines. The Inforce 67X1 reference design Kit comes with a microphone for recording and a combo jack for microphone and speaker out. It also has an audio header and details of these connectors can be found in the User Guide or HRM documents.

17. What are the sensor capabilities?

Snapdragon 845 (SDA845) processor’s Hexagon DSP cluster has a dedicated sensor core to support always-on sensor-aware apps.

18. What documents are provided? Are board design files also provided?

We provide datasheets, user guide and a Hardware Reference Manual. Schematics are not provided for the Inforce 67X1 Micro SOM. Board design files are proprietary and are the intellectual property of Inforce, and hence not provided.

All software releases are accompanied with release notes, user guides and application notes that describe the installation procedure.

19. What is the support model from Inforce after products are purchased?

Inforce offers a range of standard products off-the-shelf (OTS) on its website and through our distributors (Arrow/Mouser/Atlantik). Apart from these, it offers pre-validated build-to-order (BTO) configurations, as well as configure-to-order (CTO) options for existing products. In addition, we also offer full custom hardware design and associated software/device driver development, for those projects where a unique design is required to meet sophisticated technical challenges. All purchases of Inforce products get unlimited access to the online TechWeb support portal, which provides a host of technical documentation and software downloads. Purchasers are also provided free technical support for two support tickets. For a sustained technical support, Inforce offers Design Assistance Support Contracts for shorter periods of time and Annual Support Contracts for its customers who would like unlimited prioritized technical support. Please contact Inforce to obtain more details of the support contracts.

20. The IFC67A1 SKU is listed as Build-To-Order. What is the difference between this version and the IFC6701 version? Do we miss any features if there are only 2 B2B connectors between the SOM and the Carrier board?

The IFC67A1 SoM is a Build-To-Order SKU and thus has an MoQ of 100 units for ordering. Please contact our sales team for specific details and lead times. The additional features that are available on the IFC67A1 SoM are listed below and all of these are available on the third IO connector (IO 3). Note that IO1 and IO2 connectors are exactly the same as that of IFC6701 SoM.

Additional USB 3.0 lines. On the SYS67A1 reference design, the USB Type A connector will operate at USB3.0 speeds.
An additional MIPI-CSI interface (CSI1). On the SYS67A1 reference design, all three MIPI-CSI interfaces are operational.
Lines for Battery and charging capabilities (the battery header is thus redundant on the SYS6701)
An additional PCIe interface (PCIe0).

Networking, IO and Wireless

21. Does the device support networking and wireless communication?

Supported connectivity includes 802.11ac 2X2 MU-MIMO 2.4GHz/5GHz + Bluetooth 5.xLE (available via WCN3990) and GPS (supported via Qualcomm SDR845).

22. How can I change the MAC address for WiFi/BT/Ethernet on my Board?

MAC addresses are fixed at the factory. Changing them should not be necessary since the correct addresses are programmed before the board is shipped. If it is still required, please refer to the Release Notes and App notes available on Inforce’s TechWeb support portal.

23. What are the IO interfaces available on the SoM?

Standard I/O interfaces including I2C, SPI, UART, UIM and GPIOs are available. The interfaces available from the SoM are:

2x Camera Control I2C
1× PCIe Gen 2; 1x PCIe Gen 3
1× 4 bit SDC for SDcard
2× Line Out; 1x Ear out; 5× Mic In; 1× Headphone Out, 1xSlimBUS1; 1x MI2S
1x Sensor Core I2C
1x Backlight Regulator; 10x Regulator Out

Please refer to the product specifications in the Hardware Reference Manual or the datasheet for more information.

Software

24. What operating systems are supported and what is the OS roadmap for the Inforce 67X1 Micro SOM?

A Board Support Package (BSPs) for Android Pie is available today as an officially supported package on the Inforce TechWeb. Periodic releases shall be provided with feature improvements on this package. Inforce also upgrades the BSPs to newer Android releases and upstream Linux kernel to support feature improvements on its platforms. Please stay tuned for announcements on our website for update releases.

25. Is root access possible on Inforce boards? Could you please explain how to get root privileges in Android?

Yes. As Android derives from the Linux kernel, rooting an Android device gives similar access administrative permissions as on Linux. Please give below commands in adb shell to get root privileges

#adb root

#adb remount

26. Is fastboot supported? How to enter fastboot?

Yes. To go to fastboot mode, keep the Vol- button (for exact location, check the Quick Start Guide [QSG] document for the Inforce 67X1 Micro SOM based development kit) pressed before powering on the board and release it after the board has powered on.

27. I’ve modified the boot partitions on my board and the board is no longer booting. What should I do?

If the UFS (flash memory) partitions have been erased or the partition table has been corrupted, you can recover through a procedure that uses the USB port. Please logon to our Techweb repository to access the necessary document.

28. Is the Hexagon DSP available on the Inforce 67X1 platform?

Yes. Qualcomm’s Hexagon DSP architecture is designed to deliver performance with low power over a variety of heterogeneous computing applications. It has features such as hardware assisted multithreading, privilege levels, VLIW, SIMD and instructions geared toward efficient signal processing. The Inforce 67X1 micro SoM comes with the Hexagon™ 685 DSP with dual-Hexagon vector processor for ultra-low-power audio and computer vision processing.

Qualcomm also opens up a comprehensive Hexagon SDK for all its processors that provides for a complete environment to generate dynamic Hexagon DSP code modules. Please checkhttps://developer.qualcomm.com/software/hexagon-dsp-sdk for downloading the SDK.

29. Why isn’t Google Play (previously Android Market) available on my board?

Google Play is part of Google Mobile Services (GMS) and is licensed separately by Google. This is usually available on commercial Android devices. Though our hardware is capable of meeting requirements of the Google Test Suite that would lead to GMS certification, we have not added this to our product. Please contact our sales team if this is a requirement for your product.

Nevertheless, it is possible to side-load any Android application using the following commands:

#adb devices

#adb mount

#adb remount

#adb install apk

Should you have further questions not answered by the above FAQ and would like to have them included here, please contact Inforce Computing.

Inforce Computing offers SKU variants of the Inforce 67X1 SoM to suit varied end-use applications.

Part Number	Description	Single Unit Price
IFC6701-00-P1	SD845 Micro SoM (Android Pie OS); 2x B2B conn; Commercial Temp support (0⁰ - 70⁰C)	$285
IFC67A1-00-P1	SD845 Micro SoM (Android Pie OS); 3x B2B conn; Commercial Temp support (0⁰ - 70⁰C)	$300
SYS6701-00-P1	IFC6701-00-P1 SoM based Ref Design	$600
SYS67A1-00-P1	IFC67A1-00-P1 SoM based Ref Design	Contact Sales

For more information and to place an order for more quantities, contact the Inforce sales team at (510) 683-9999 or at sales@inforcecomputing.com.

Additional Info

SKU	IFC6701

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INFORCE 6701™ MICRO SYSTEM ON MODULE (SoM)

Quick Overview