close tools

The product configuration you chose is a build-to-order (BTO) option.

Typical lead time for BTO SKU fulfilment is 6-8 weeks. Please contact Inforce computing at

+1-510-683 9999

or send an email to

sales-wc@smartwirelesscompute.com

for accurate pricing and shipping times.

Alternatively, you may choose a standard off-the-shelf configuration for faster shipment lead times.

Smart Wireless Computing
Cart (0 items)
Log In

Log In

Forgot Your Password?

Cart Subtotal: $0.00
  • Home
  • Inforce 6502 System On Module LP

Inforce 6502

Micro SoM based on the first Kryo™ CPU on 600-tier Snapdragon

Complete 4k30 encode/decode system on a small form factor

Production-ready with extended temperature support

Inforce 6502 Micro SoM is a perfect fit for applications that have size, weight, and (low) power (SWaP) constraints. With it's advanced performance, support for extended temperatures and compatibility with all Micro SoMs from Inforce, it is an ideal platform for compute intensive applications that specifically require Integrated Connectivity and Machine Learning
 

The Snapdragon 660 System on Chip
 

Neural Networks

Neural Networks

Flexibility to run neural network models heterogeneously across various cores which is a distinct advantage for customers whose products require machine learning

Enhanced Graphics

Graphics GPU Qualcomm qcs410 Qualcomm qcs610 Nanosom for edge compute applications

Superior graphics performance and compute capabilities coupled with decreased power consumption with the Adreno 512 GPU

Improved Power Efficiency

Improved Power Efficiency

Power efficient and dedicated apps on the Hexagon™ 680 DSP with Hexagon Vector eXtensions designed to support Low Power Island for sensor processing

Faster Video Processing

Faster Video Processing

Shared virtual memory with CPU for heterogeneous computing results in faster video processing with low power consumption

  

Resilient and Upgradable

Resilient and Upgradable

Compatible with Inforce reference carrier board design and thus enables easy migration to higher performance SoMs
 

What is Inside?

 

Technical Specifications

CPU

Qualcomm® Kryo™ 260 CPU:
Manufactured in 14nm, bringing Kryo
to the 600-tier for the first time

GPU

Qualcomm® Adreno™ 512 GPU:
Enhanced gaming performance for
lifelike visuals and more efficient
rendering of advanced 3D graphics

DSP

Qualcomm® Hexagon™ 680 DSP
includes Hexagon Vector eXtensions (HVX),
designed to support Caffe2 and Tensorflow
for machine learning and image processing

Connectivity

Bluetooth 5.0

Wi-Fi integrated 802.11ac 2x2
with MU-MIMO and Dual Band Simultaneous
(DBS) operation

Location

GPS

Memory/Storage

3GB LPDDR4, 32GB eMMC

Camera

Concurrent dual MIPI-CSI
cameras for UltraHD video
streaming and capture

Multimedia

Complete 4k30 encode/decode system

Concurrent dual independent displays

Operating Systems

Full featured Android Oreo

Periodic upgrades with dedicated support
 

Inforce 6502 Reference Design

Inforce has created a reference carrier that brings out all native interfaces of the SDA660 processor including USB-C to help create and optimize your products with the shortest turnaround time. Off-the-shelf camera module accessories are available that work out of the box with this platform.

Plug-n-Play camera module accessories
 

Support Plans
 

How to Buy Inforce 6502

Part Number

Description

Pricing

Availability

IFC6502-00-P1

Snapdragon 660 processor, Android OS, 3GB RAM, 32GB eMMC.
Commercial Temperature support

$208

Order Online

IFC6502X-00-P1

Snapdragon 660 processor, Android OS, 3GB RAM, 32GB eMMC. EMI Shields.
Extended Temperature support

$208

Contact Sales

SYS6502-00-P1

IFC6502-00-P1 with carrier ACC-1C20-P1

$500

Order Online