Tag Archives: Thermal

Smart Wireless Computing’s Thermal based blog articles are listed on this page

Thermal Dissipation Techniques on Snapdragon Systems

Thermal Dissipation Techniques on Snapdragon SystemsAs IoT devices become more capable, delivering the necessary performance to enable immersive experiences to users is a complex challenge owing to the power and thermal constraints on these devices. To address this challenge, a design approach that specifically caters to portable devices without a constant power source is essential. An optimal and thermal efficient design is only possible by taking a holistic approach to power management across the system including the choice of materials for the product enclosures. Continue reading Thermal Dissipation Techniques on Snapdragon Systems