On Tuesday, Inforce Computing was featured at the Qualcomm® Snapdragon™ for Embedded Community event in San Francisco where they announced the availability of the Snapdragon 410E and 600 embedded processors. These processors were specifically designed for IoT and embedded applications. Whether you are a global OEM or a maker working out of your garage, the Internet of Things is the future. We will soon see millions of devices communicating with us and each other in every aspect of our lives. And the best part, Qualcomm has committed to supporting these processors for at least 10 years which is great news to IoT and embedded application developers.
In a previous blog, we spoke about the need for high-performance computing at the edge of the network for a video analytics IoT use-case. We will continue along the same vein in this article, but will look at the transformation happening at Industrial IoT in the asset tracking, monitoring, and maintenance marketplace. While this is an extremely broad subject with thousands of use-cases, we will make an effort to look at it from an Industrial IoT perspective with a few examples.
Why is asset tracking important?
Most companies that have their valuable assets distributed over a large geographical area have to contend with a host of problems that affect their productivity, operational efficiencies, staffing, costs, and ultimately their bottom-line, among other things. These issues could manifest in the form of poor health of their assets, theft, pilferage, damage due to natural calamities, underperformance, safety, productivity, counterfeiting, leakage, excessive pollution and carbon emissions to outright loss of perishable goods, and the list goes on and on. In the past, there haven’t been cost-effective ways to monitor these assets to be able to take timely and corrective action or act on deep insights for better outcomes. Meaningful data collection has been quite expensive as well. Not anymore. Continue reading Asset Tracking: Industrial IoT Solutions for Improved Outcomes
Hope all of you have had a great start to 2016 after a much needed Christmas and New Year’s break. If you will be at CES 2016 this week (January 6-9) in Las Vegas, please do stop by the following Qualcomm® booths to take a look at Inforce Computing’s exciting Snapdragon™ processor-based compute platforms in the form of SBCs, SoMs, and development kits.
1. Qualcomm Main Booth: Central Hall, #8952–What to see:
- IoT Wall:
- An Enterprise Videoconferencing Endpoint solution powered by a custom Inforce 64XX SBC (Snapdragon 600 processor)
- A connected point-of-care (battery operated/portable) Ultrasound Imaging System powered by an Inforce 64XX SoM (Snapdragon 600)
- Smart Cities Area:
- Inforce 6309 Micro SBC (Snapdragon 410) for industrial IoE applications at the edge-of-the-network
- Inforce 6401 Micro SoM (Snapdragon 600) for SWaP constrained designs requiring low power and full-HD video processing
- Inforce 6540 SBC and Inforce 6501 Micro SoM (Snapdragon 805) for 4K Ultra HD video capture/playback and high-end processing
2. Qualcomm Unmanned Systems Booth: South Hall, #25824–what to see:
- Inforce Robotics Development Kit running ROS on Linaro Linux: Inforce 6410Plus SBC (Snapdragon 600) and a Peripheral Abstraction Core (PAC) Mezzanine card with an ARM® Cortex®-M4; Grove connectors and Arduino compatibility for connecting multiple external sensors, SBUS for motor control, 10 DoF on-board sensors, and more.
Best wishes for a wonderful year ahead! Don’t hesitate to contact us if you need further information.
Commercialize Your Next Gen Industrial IoE Product Based on the Qualcomm® Snapdragon™ 410 Processor
OK, have you been working on or thinking of bringing that cool high-performance next generation industrial internet-of-everything (IoE) idea to market? Are you feeling weighed down by stringent requirements such as robust upstream Linux kernel/Android OS and device driver support, extended operating temperature range (you could possibly be designing a next-gen outdoor smart signage or billboard that does real-time heavy-duty analytics, to withstand the deep freeze of the winter in Minneapolis or sizzling summers in Las Vegas or Phoenix), and your end-products have a long product lifecycle? Does your product live in hostile environments (electrical and thermal) that requires EMI noise protection, proper thermal design/heat dissipation, and are actively considering including things like Power-over-Ethernet and RS485 ports? While all of this sounds really exciting and challenging at the same time, are you struggling to find the right high-performance compute platform that fits these needs in a cost-effective and reliable way to scale to production volume manufacturing? Despair not; help is on the way in the form of the latest Inforce 6309 Micro SBC, powered by the Qualcomm Snapdragon 410 processor!