Commercialize Your Next Gen Industrial IoE Product Based on the Qualcomm® Snapdragon™ 410 Processor
OK, have you been working on or thinking of bringing that cool high-performance next generation industrial internet-of-everything (IoE) idea to market? Are you feeling weighed down by stringent requirements such as robust upstream Linux kernel/Android OS and device driver support, extended operating temperature range (you could possibly be designing a next-gen outdoor smart signage or billboard that does real-time heavy-duty analytics, to withstand the deep freeze of the winter in Minneapolis or sizzling summers in Las Vegas or Phoenix), and your end-products have a long product lifecycle? Does your product live in hostile environments (electrical and thermal) that requires EMI noise protection, proper thermal design/heat dissipation, and are actively considering including things like Power-over-Ethernet and RS485 ports? While all of this sounds really exciting and challenging at the same time, are you struggling to find the right high-performance compute platform that fits these needs in a cost-effective and reliable way to scale to production volume manufacturing? Despair not; help is on the way in the form of the latest Inforce 6309 Micro SBC, powered by the Qualcomm Snapdragon 410 processor!